电子封装用陶瓷材料研究现状
摘要
关键词
全文:
PDF参考
张翼.微电子封装的发展历史和新动态[J].机械工程与自动化,2016(1):216-221.
张力元.微电子封装技术的发展趋势[J].百家论坛,2012(4):42-46.
田民波,梁形翔,何卫.电子封装技术和封装材料[J].半导体情报,1995,32(4):42-61.
Imanaka Y.Multilayered Low Temperature Cofired Ceramics (LTCC) Technology [M].Boston:Springer,2005.
邓安强,樊静波,谭占秋,等.金刚石/铜复合材料在电子封装材料领域的研究进展[J].金刚石与磨料磨具工程,2010,30(5):56-61.
曾小亮.电子封装基板材料研究进展及发展趋势[J].集成技术,2014,3(6):76-83.
程浩,陈明祥,罗小兵,等.电子封装陶瓷基板[J].现代技术陶瓷,2019,40(4):265-292.
Andy P,Suresh K S.Universal Fatigue Life Prediction Equation for Ceramic Ball Grid Array (CBGA) Packages[J].Microelectronics Reliability,2007,47(12):2260-2274.
汤涛,张旭,许仲梓.电子封装材料的研究现状及趋势[J].南京工业大学学报：自然科学版,2010,32(4):105-110.
张文毓.电子封装材料的研究与应用[J].上海电气技术,2017,10(2):72-77.
Wan Y J,Li G,Yao Y M,etal.Recent advances in polymer-based electronic packaging materials[J].Composites Communications,2020,19(2020):154-167.
方润.电子封装的发展[J].科协论坛(下半月),2012(2):84-86.
Kiikol V S,Vaispapir V Y.Thermal Conductivity and Prospects for Application of BeO Ceramic in Electronics[J].Glass and Ceramics,2015,71(12):387-391.
Wang L Z,Zhao W Q,Mei X S,etal.Improving quality and machining efficiency of hole during AlN trepanning with nanosecond pulse laser[J].Ceramics International,2020,46(15):24018-24028.
Li H Y,Xi X,Ma J,etal.Low-temperature sintering of coarse alumina powder compact with sufficient mechanical strength[J].Ceramics International,2017,43(6):5108-5114.
丁利文,范桂芬,李镜人,等.AlN陶瓷的性能及应用[J].现代技术陶瓷,2016,37(1):22-33.
Zhou Y,Hirao K,Watari K,etal.Thermal conductivity of silicon carbide densified with rare-earth oxide additives[J].Journal of the European Ceramic Society,2004,24(2):265-270.
张兆生,卢振亚,陈志武.电子封装用陶瓷基片材料的研究进展[J].材料导报,2008,22(11):16-20.
Zhou Y,Hyuga H,Kusano D,etal.Development of high-thermal-conductivity silicon nitride ceramics[J].Journal of Asian Ceramic Societies,2015,3(3):221-229.
刘兵,彭超群,王日初,王小锋,李婷婷,王志勇.Al2O3陶瓷基片电子封装材料研究进展[J].中国有色金属学报,2011,21(8):1893-1903.
张晓辉,郑欣.低温共烧陶瓷材料的研究进展[J].微纳电子技术,2019,56(10):797-805.
郑琼娜,王双喜,欧阳雪琼,尤晶,黄国权.低温共烧陶瓷材料及其制备工艺[J].中国陶瓷,2010,46(10):7-11.
Arcaro S,Cesconeto F R,Raupp-Pereira F,etal.Synthesis and characterization of LZS/α-Al2O3 glass-ceramic composites for applications in the LTCC technology[J].Ceramics International,2014,40(4):5269-5274.
Kuramoto N,Takada K.Applications of aluminum nitride (AlN) ceramics[J].Key Engineering Materials,2003,247(2003):467-472.
Shigeno K,Li M Y,Fujimori H.Development of novel temperature-stable Al2O3–TiO2-based dielectric ceramics featuring superior thermal conductivity for LTCC applications[J].Journal of the European Ceramic Society,2021,41(1):376-386.
伍海东,刘伟,程利霞,等.烧结温度对96Al2O3陶瓷力学性能及热导率的影响 [J].人工晶体学报,2017,46(9):1864-1868.
夏清,严运,严小艳,等.烧结助剂对95氧化铝瓷性能的影响[J].硅酸盐通报,2014,33(2):266-270.
Yang Y,Ma M S,Zhang F Q,etal.Low-temperature sintering of Al2O3 ceramics doped with 4CuO-TiO2-2Nb2O5 composite oxide sintering aid[J].Journal of the European Ceramic Society,2020,40(15):5504-5510.
Wang F,Lou Y H,Li Z J,etal.Improved flexural strength and dielectric loss in Al2O3-based LTCC with La2O3–CaO–B2O3–SiO2 glass[J].Ceramics International,2021,42(7):9955-9960.
Chen G Y,Liu Z F,Ma M S,etal.Composites of Li-Al-B-Si-O glass and β-Al2O3 for LTCC-silicon heterogeneous integration applications[J].Ceramics International,2018,44(18):141-144.
Zhang X L,Chen N,Wu J M,etal.Rapid fabrication of surface microstructures on AlN HTCC substrate by chemically assisted laser ablation[J].Ceramics International,2021,47(19):27598-27608.
姚晓明,张耀辉,于云飞,等.氮化铝陶瓷材料的介电性能[J].安全与电磁兼容,2017(2):47-84.
Huang D,Tian Z B,Cui W,etal. Effects of Y2O3 and yttrium aluminates as sintering additives on the thermal conductivity of AlN ceramic substrates[J].Ceramics International,2018,44(16):20556-20559.
Yuan L N,Liu B,Shen N N,etal.Synthesis and properties of borosilicate/AlN composite for low temperature co-fired ceramics application[J].Journal of Alloys and Compounds,2014,593(13):34-40.
Fang X Y,Lv Y Y,Zhang L,etal.Effect of AlN addition on phase formation in the LTCC with Al2O3/AlN biphasic ceramics based on BBSZ glass[J].Ceramics International,2020,46(10):16895-16900.
Teng F,Yu K,Luo J,etal.Microstructures and properties of Al–50%SiC composites for electronic packaging applications[J].Transactions of Nonferrous Metals Society of China,2016,26(10):2647-2652.
Li S,Xiong D G,Liu M,etal.Thermophysical properties of SiC/Al composites with three dimensional interpenetrating network structure[J].Ceramics International,2014,40(5):7539-7544.
Lu Y P,Zang X R,Du B,etal.Investigation of the effect of the SiC particle size on the properties of the AlN–SiC composite ceramic[J].Materials Chemistry and Physics,2021,261(74):124222-124240.
张伟儒,高崇,郑彧.氮化硅:未来陶瓷基片材料的发展趋势[J].新材料产业,2016(11):34-37.
Liu W,Tong W X,Lu X X,etal.Effects of different types of rare earth oxide additives on the properties of silicon nitride ceramic substrates[J].Ceramics International,2019,45(9):12436-12442.
Liu W,Tong W X,He R X,etal.Effect of the Y2O3 additive concentration on the properties of a silicon nitride ceramic substrate[J].Ceramics International,2016,32(10):1160-1179.
Luo Z W,Zhang J,Lin C W,etal.Synthesis and properties of AlN/MAS/Si3N4 ternary glass-ceramic composites with in-situ grown rod-like β- Si3N4 crystals[J].Ceramics International,2018,44(2):1875-1880.
Aravindraj E,Ayyappan K,Kumar R.Performance analysis of rectangular MPA using different substrate materials for WLAN application[J].ICTACT Journal on Communication Technology,2017,8(1):1447-1452.
陈寰贝,庞学满,胡进,等.航空航天用电子封装材料及其发展趋势[J].电子与封装,2014,14(5):6-9.
Zhu X D,Kong F T,Ma X S.Sintering behavior and properties of MgTiO3/CaO-B2O3-SiO2 ceramic composites for LTCC applications[J].Ceramics International,2019,45(2):1940-1945.
Fang H M,Bai S L.Thermal,mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application[J].Composites Part A: Applied Science and Manufacturing,2017,100(15):71-80.
Wang S X,Liu G S,OuYang X Q,etal.Fabrication of Al2O3/glass/Cf composite substrate with high thermal conductivity[J].Journal of Materials Engineering and Performance,2016,25(2):642-647.
Slack G A.Nonmetallic crystals with high thermal conductivity[J].Journal of Physics and Chemistry of Solids,1973,34(2):321-335.
Hu G L,Chen C Q,Ramesh K T,etal.Mechanisms of dynamic deformation and dynamic failure in aluminum nitride[J].Acta Materialia,2012,60(8):3480-3490.
杨振涛,彭博,刘林杰.等.一种应用于12GHz的AlN多层陶瓷外壳[J].半导体技术,2021,46(2):158-168.
Xu M,Girish Y R,Rakesh K P.Recent advances and challenges in silicon carbide (SiC) ceramic nanoarchitectures and their applications[J].Materials Today Communications,2021,28(17):102533-102560.
Li Y S,Kim H N,Wu H B,etal.Microstructure and thermal conductivity of gas-pressure-sintered Si3N4 ceramic: the effects of Y2O3 additive content[J].Journal of the European Ceramic Society,2020,41(1):274-283.
史晓飞,吕家璘,张晓明,等.低温共烧陶瓷（LTCC）技术研究及在航天领域的应用[J].宇航材料工艺,2015(1):89-91.
DOI: https://doi.org/10.33142/ec.v4i10.4598
Refbacks
- 当前没有refback。
版权所有（c）{$ COPYRIGHTYEAR} {$ copyrightHolder}
此作品已接受知识共享署名-非商业性使用 4.0国际许可协议的许可。