Research and Application of Materials Science

Research Progress of Ceramic Metallization Technology

XIANGYang, XIONGXuechong, WENJin, ZHAOGuangyao, PENGZhihang, CAOFeng

Abstract


Due to the wide application of ceramics in electronic device packaging, the performance of ceramic metallization layer directly determines the performance of the whole package device. This paper introduces the main preparation methods of ceramic metallization, discusses the influence of Mo powder size, metallization formula, sintering temperature and other factors on the performance of ceramic metallization layer prepared by activated Mo-Mn method, and introduces several kinds of methods that can be tested to test the performance of ceramic metallized sealing samples. A new research direction of Ceramic Metallization Technology in the advanced field is put forward.

Keywords


ceramic-metal sealing; metallization of ceramics; preparation method

Full Text:

PDF

References


Gao L Q, Liu Z. Progress of Ceramic to Metal Seal Technology in China[J].Shandong Ceramics，2019,42(02):7-12. (In Chinese)

Cao C W, Feng Y B,Qiu T, Liang T. Surface Oxidation and Metallization of AlN Ceramics by Mo-Mn Process[J].Journal of Synthetic Crystals, 2017,46(03):416-421+432.(In Chinese)

Chen D Q, Lin F, Xiao L R, Qiu T, Cai H P, Jiang X L, Yi D Q. Research and Development of DBC packaging Materials. 2004(06):76-78+82.(In Chinese)

Zhai T L, Lin G A, Yao B, Ding M M, Xie J J, Shi Y Y, Li D S, Wu, Z H. Interface Bonding Properties and Microstructure of AlN/Cu Composite Substrate[J]. Journal of the Chinese Ceramic Society, 2017,45(07):1037-1042.(In Chinese)

Wang Y, Cao J, Zhang L X, Feng J C. Review on active brazing of alumina ceramic and metal[J], Welding & Joining,2009(02):56-60+71.(In Chinese)

Xiong L Y. Preparation and Characterization of Ag-Cu-Ti Active Paste for Brazing[D], Nanjing University of Aeronautics and Astronautics, 2018.(In Chinese)

Xin C L, Liu W B, Li N, et al. Metallization of Al2O3 ceramic by magnetron sputtering Ti/Mo bilayer thin films for robust brazing to Kovar alloy [J]. Ceramics International, 2016,42(8):9599-9604.

Gao L Q, Gao Y Q. Total Process of Glass Phase Migration in Ceramic Metallization[J]. Shandong Ceramics, 2010,33(04):3-5+16.(In Chinese)

Xun Y H, Zhang J X, Chen M L, Gao L Q. Processing of Metallizing Alumina Ceramic with Mo-Mn-Ti-Si-Al System Paint[J]. Vacuum electronics, 2011(01):26-29.(In Chinese)

Gao L Q. Molybdenum Powder and Ceramic Metallizing Technology[J]. Vacuum Electronics, 2012(04):1-5+15.(In Chinese)

Cui Y, Can A F, Chen X H, Huang Y G. The Influence of Mo Powders on Metallizing[J]. Vacuum Electronics,2013(04):88-91.(In Chinese)

Li J Y, Zhao R F. Effects of the Fine Molybdenum Powder on the Quality of 95％ Alumina Ceramics Metallizing and the Analysis of Existing Problems[J]. Vacuum Electronics, 2014(04):67-71.(In Chinese)

Gao L Q. Design Principle of the Ceramic Metallizing Formulae[J]. Vacuum Electronics, 2002(03):21-23.(In Chinese)

Yang X R. Preparation and Properties of Metallization Layer used for Packaging Transistors, Shandong University,2016.(In Chinese)

Huang Y G，CaiA F，Liu Y Q，Liu H Q. Various Components of Activating Agent for Molybdenum Manganese Metallization Play the Role in the Formulation[J]. Vacuum Electronics, 2008(04):42-46+59.(In Chinese)

GAO L Q, Recent Development of Ceramic to Metal Seal and Its Relative Technology[J]. Vacuum Electronics, 2000(05):20-26.(In Chinese)

KOTO WHITE, Daniel P. KRAMER. Microstructure and Seal Strength Relation in the Molybdenum-Manganese Glass Metallization of Alumina Ceramics[J]. Materials Science and Engineering, 1985,75(1-2):207-213.

Huang Y G, Liu X F, Liu H Q, The Influence of Hydrogen Humidity on Product Quality of Ceramic Metallization[J]. Vacuum Electronics, 2010(02):54-58.(In Chinese)

Zhong W, Zou G J. Modeling and Simulation of Temperature Field in Al2O3 Ceramic Metallization[J]. 2016,36(06):718-722.(In Chinese)

Zhang J X. Microstructure of Metallized Alumina Ceramics Applied in Vacuum Electronics Comp onents of Domestic and Oversea[J]. Vacuum Electronics, 2003(04):27-28+39.(In Chinese)

Wang L, Kang W T, Guo P Z, et al. Influence of Ceramic Substrate Porosity and Glass Phase Content on the Microstructure and Mechanical Properties of Metallized Ceramics via an Activated Mo-Mn method [J]. Ceramics International, 2020,46(6):8244-8254.

Wang L, Kang W T, Gao P Z, Kang D H, Zhang H H. Research Progress of Methods, Mechanisms and Influencing Factors of Ceramic Metallization[J]. Journal of Ceramics, 2019,40(04):411-417.(In Chinese)

Cheng W Q, Chen J H. Analysis and Discussion on Measuring the Thickness of Ceramic Metallization Layer with Different Testing Equipment[J]. Ceramics Science ＆ Art, 2010,(10):18-20.(In Chinese)

Cheng W Q. Test and Application of Ceramic-Metal Sealing Tensile Strength[J]. Ceramics Science & Art, 2006(02):4-6.(In Chinese)

Shi M, Zheng J X, Gao L Q, Liu Z. Study on Fatigue Behaviors of Metalized Al2O3 Ceramic Seals[J]. Bulletin of The Chinese Ceramic Society, 2012,31(04):1035-1038.(In Chinese)

Qi L J, Zheng J P, Lei H Z. Brazing Process and Application Performance of Monocrystal Al2O3 Ceramic/Nb-1Zr Alloy Sealing Parts[J]. Vacuum Electronics, 2016(01):58-63.(In Chinese)




DOI: https://doi.org/10.33142/msra.v2i1.1973

Refbacks

  • There are currently no refbacks.


Copyright (c) 2020 Yang XIANG, Xuechong XIONG, Jin WEN, Guangyao ZHAO, Zhihang PENG, Feng CAO

Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.